| Materials |
FR-4, CEM-3, HF material
(FR-4, CEM-3) |
| Layer coverage |
Double side to 16 Layers,
Build up 2+N+2 |
| Board thickness |
0.10mm to 3.2mm for double sided
0.4mm up for 4 layers.
4.0mm for 16 layers
|
| Copper cladding |
(Inner) 18um to 105um
(Outer) 12mm to 140mm |
| Minimum trace |
(width/spacing) 0.075mm |
| Hold size tolerance |
(NPTH) ±0.05mm
(PTH) ±0.05mm |
| Minimum hole size |
Finish, mechanical - 0.15mm
Finish, laser - 0.10mm |
| Aspect ratio |
Vias ≦8:1
Build vias ≦0.7:1 |
| Surface finishes |
HAL, immersion gold, pre-flux (OSP) |
| Lead-free finishing |
HAL (copper-silver-nickel-tin),
immersion gold, pre-flux (OSP) |